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0.3 mm pitch CSP in development!

Call now. Let us capture your 0.3 mm-pitch input!

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Tel: 1-508-236-1868

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burninsockets@sensata.com

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sensata.com/burninsockets


Site Updated October 16, 2016

* * * Sensata > Support > Burn-in Test Socket Engineering > Contact Technology >

BGA Pinch Contact Style for Burn-in Test Sockets
Off–set and In–line Contacts


Off–set contact = 0.8 to 1.27 mm pitch
In–line contact = 0.5 mm pitch or less


Sensata also offers a small 26x19.50 mm outline through–hole socket for smaller 0.50 mm packages. This socket can accept packages up to 11x17 mm and utilizes a dual pinch style contact, eliminating any witness marks on the bottom of the ball.


Dual pinch contacts for BGA pitches 0.5-1.0mm and 0.8-1.27mm

Above: (Left) Off–set contact used for BGA pitches of 0.8–1.27mm. (Middle) In–line contact used for BGA pitches 0.5–1.0mm. (Right) Dual pinch contact, Sensata internal SEM photograph showing minimal ball damage.


Mechanical Characteristics
Contact system
Normally closed
Package insertion force
ZIF
Contact force
Typical: Approximately 15g/pin
Range: 10–20g/pin
Durability
Minimum: 10,000 cycles
Temperature range
-55°C to 150°C
Contact point
Side of solder ball
Maximum IC offset
During load: ±1.0 mm in X or Y axis
Actuation force
Typical: 1.0kg

Electrical Characteristics
Current rating
1 amp per pin
Insulation resistance
1000 mohms at 500V DC
Dielectric voltage
Withstands 700V AC for 1 minute
Contact resistance at 10mA
Initial: 50 mohm maximum
After 10K cycles: 1 ohm maximum
Inductance
6nH at 50 MHz, approximately
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BGA buckling beam contact

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Product Accommodations
Maximum sizes

I/O: 10 x 10 array
IC size: 11 x 11 mm

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Pinch style contact
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