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  • 0.5mm and 0.8mm pitch
  • Compression surface mount
  • High performance/low cost achieved through use of carrier loaded stamped contact
  • Z-axis compliant buckling beam contact supports any type solder ball shape and composition
  • Compact outline and low actuation force achieved through use of innovative latching mechanism



Body Materials PEI, PES, LCP, or Equivalent
Contact Material Beryllium Copper Alloy
Contact Plating Gold
Contact Force 13 gram average
Contact Resistance 200~300 mΩ typical
Temperature Rating Burn-in 150°C
Durability 10,000 cycles min.

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