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  • 0.5mm and 0.8mm pitch
  • Compression surface mount
  • High performance/low cost achieved through use of carrier loaded stamped contact
  • Z-axis compliant buckling beam contact provides stable contact performance independent of solder ball height and compression
  • Advanced latch mechanism with flexible pressure pads provides uniformed force distribution across the package surface, enabling the socket to handle up to 900 balls (full 30x30 matrix) and super thin packages.



Body Materials PES, PEI, LCP, or Equivalent
Contact Material Beryllium Copper Alloy
Contact Plating Gold
Contact Force 13 grams average
Contact Resistance 200~300 mΩ
Temperature Rating 150°C
Durability 10,000 cycles min.

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