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  • 0.4mm pitch
  • Compression surface mount
  • High performance/low cost achieved through use of carrier loaded stamped contact
  • Z-axis compliant buckle beam contact supports any type of solder ball



Body Materials PES, PEI, LCP or Equivalent
Contact Material Beryllium Copper Alloy
Contact Plating Gold
Contact Force 13 gram average
Contact Resistance 200-300 mΩ
Temperature Rating 150°C
Durability 10,000 cycles min.

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